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Formulated to work with any alloy and heating process Nordson EFD’s FluxPlus is perfect for BGA rework mobile device repair reflowing solder paste and more Liquidyn® PJet SolderPlus® Jetting System This complete solder paste jetting system includes the Liquidyn PJet SolderPlus jet valve which is designed specifically to jet Nordson EFD SolderPlus solder paste 794 / 794.
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The assembly lines in NationGate has been set up with automated and semi automated machines for example Auto soldering stations Auto screw stations and Auto glue dispensing stations Such automation are utilized to ensure consistency in quality and process These lines and machines allow the company to operate on a higher and longer work schedules and platforms of 24/7.
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Temperature and variable control are key These features will help improve soldering so be sure to consider the temperature ranges and variable control when choosing a soldering station Keep extra nozzles and tips on hand These are inexpensive and consumable It’s easier and more cost effective to purchase extras in advance rather than place another order and pay for shipping in.
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Finally for really advanced ICs there are ball grid array (BGA) packages These are amazingly intricate little packages where little balls of solder are arranged in a 2D grid on the bottom of the IC Sometimes the solder balls are attached directly to the die! BGA packages are usually reserved for advanced microprocessors like those on the pcDuino or Raspberry Pi If you can hand.
